3D IC and 2.5D IC Packaging Market

Executive Summary

3D IC and 2.5D IC Packaging Market from Consainsights analyses the 3D IC and 2.5D IC Packaging Market Market in the Technology & Media industry over the forecast period to 2027.

3D IC and 2.5D IC Packaging Market research report from Consainsights outlines the detailed strategic analysis, trends, market opportunities, growth prospects, industry and market challenges and sustainable solutions to sustain in the competitive environment.

3D IC and 2.5D IC Packaging Market segmentation includes Packaging Technology, Application, End-User Industry and Geography.

All segmentations encompasses the key innovations and micro & macro trends, companies/manufacturers operating in this space along with their usage and penetration with respect to the wide range of End Users. Additionally, market sizing information along with the key factors such as market drivers, restraints, opportunities and challenges which are likely to be influencing the market growth are outlined in this report.

Based on the Packaging Technology, the 3D IC and 2.5D IC Packaging Market analysis covers Wafer-Level Chip-Scale Packaging (WLCSP), TSV, 2.5D.

Based on the Application, the 3D IC and 2.5D IC Packaging Market analysis covers Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power, Analog & Mixed Signal, RF, Photonics.

Based on the End-User Industry, the 3D IC and 2.5D IC Packaging Market analysis covers Consumer Electronics, Telecommunication, Industrial Sector, Automotive, Military & Aerospace, Smart Technologies, Medical Devices.

Key companies operating in the market include Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), ASE Group (Taiwan), Amkor Technology (U.S.), United Microelectronics Corp. (Taiwan), Stmicroelectronics Nv (Switzerland)., Broadcom Ltd. (Singapore), Intel Corporation. (U.S.), Jiangsu Changjiang Electronics Technology Co., Ltd (China) and so on. This report covers the detailed analysis of the company profiles such as business segments, product portfolio, key brand insights and growth strategies adopted, company SWOT and Strategy analysis along with the financial analysis and analyst insights on the key companies operating in this market.

Moreover, the competitive analysis includes the companies deals such as Mergers, Acquisitions, Partnerships and so on along with the expansion areas focusing on the additional geographies, future insights for success and market share analysis. Major players strategies include the launch of the innovative product lines along with the emphasis on the partnerships and acquisitions to standardize their market share in the market space.

Market Research methodology includes the triangulation of the data from the data sources such as Primary Market Research approach and Secondary Market Research Approach along with the data from the trade bodies and industry standard publications and data sources. Primary inputs from the industry experts and the market respondents from the respective industries to obtain very critical information to assess the future growth prospects of the market. The final data is triangulated and thoroughly validated considering all the data sources using the bottom-up and the top-down approaches to estimate the market sizing of the individual segments.

Market Overview

• Definition & Scope
• Currency, Year & Forecast

Definition & Scope

• The base currency considered was the US Dollar (USD). Conversion of other currencies to USD was considered on the basis of the average exchange rate for the respective review-period years. The exchange rate conversion for forecast period was determined according to the base year’s conversion rates.
• The base year was identified based on the availability of annual reports and secondary information. The base year considered for this study is 2027.
• The review period considered for this study is from 2018-2027. The CAGR is for the forecast period, 2022-2027.
• Market size estimations for the forecast years were in real terms. Inflation is not part of the pricing, and the average selling price (ASP) was kept constant throughout the forecast period for each country.
• Distribution of primary interviews conducted was based on the regional share of the market and the presence of key players in each region.
• As a result of data triangulation through multiple methodologies and approaches, the weighted averages of resulting estimates were considered to be the final values.

By Packaging Technology

• Introduction
• Wafer-Level Chip-Scale Packaging (WLCSP)
• TSV
• 2.5D

Introduction

By By Packaging Technology, The 3D IC and 2.5D IC Packaging Market analysis covers Wafer-Level Chip-Scale Packaging (WLCSP), TSV, 2.5D.

Wafer-Level Chip-Scale Packaging (WLCSP)

The Wafer-Level Chip-Scale Packaging (WLCSP) segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

TSV

The TSV segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

2.5D

The 2.5D segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

By Application

• Introduction
• Logic
• Imaging & Optoelectronics
• Memory
• MEMS/Sensors
• LED
• Power, Analog & Mixed Signal, RF, Photonics

Introduction

By By Application, The 3D IC and 2.5D IC Packaging Market analysis covers Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power, Analog & Mixed Signal, RF, Photonics.

Logic

The Logic segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Imaging & Optoelectronics

The Imaging & Optoelectronics segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Memory

The Memory segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

MEMS/Sensors

The MEMS/Sensors segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

LED

The LED segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Power, Analog & Mixed Signal, RF, Photonics

The Power, Analog & Mixed Signal, RF, Photonics segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

By End-User Industry

• Introduction
• Consumer Electronics
• Telecommunication
• Industrial Sector
• Automotive
• Military & Aerospace
• Smart Technologies
• Medical Devices

Introduction

By By End-User Industry, The 3D IC and 2.5D IC Packaging Market analysis covers Consumer Electronics, Telecommunication, Industrial Sector, Automotive, Military & Aerospace, Smart Technologies, Medical Devices.

Consumer Electronics

The Consumer Electronics segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Telecommunication

The Telecommunication segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Industrial Sector

The Industrial Sector segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Automotive

The Automotive segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Military & Aerospace

The Military & Aerospace segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Smart Technologies

The Smart Technologies segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Medical Devices

The Medical Devices segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Company Analysis

• Introduction
• Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
• Samsung Electronics Co., Ltd. (South Korea)
• Toshiba Corp. (Japan)
• ASE Group (Taiwan)
• Amkor Technology (U.S.)
• United Microelectronics Corp. (Taiwan)
• Stmicroelectronics Nv (Switzerland).
• Broadcom Ltd. (Singapore)
• Intel Corporation. (U.S.)
• Jiangsu Changjiang Electronics Technology Co., Ltd (China)

Introduction

Key companies operating in the market include Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), ASE Group (Taiwan), Amkor Technology (U.S.), United Microelectronics Corp. (Taiwan), Stmicroelectronics Nv (Switzerland)., Broadcom Ltd. (Singapore), Intel Corporation. (U.S.), Jiangsu Changjiang Electronics Technology Co., Ltd (China) and so on. This report covers the detailed analysis of the company profiles such as business segments, product portfolio, key brand insights and growth strategies adopted, company SWOT and Strategy analysis along with the financial analysis and analyst insights on the key companies operating in this market.