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3D IC and 2.5D IC Packaging Market

3D IC and 2.5D IC Packaging Market Research Report – Segmented By Packaging Technology (Wafer-Level Chip-Scale Packaging (WLCSP), TSV, 2.5D), By Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power, Analog & Mixed Signal, RF, Photonics), By End-User Industry (Consumer Electronics, Telecommunication, Industrial Sector, Automotive, Military & Aerospace, Smart Technologies, Medical Devices) & Region (North America, Europe, APAC, Latin America, Middle East and Africa) – Analysis on Size, Share, Trends, COVID-19 Impact, Competitive Analysis, Growth Opportunities and Key Insights from 2019 to 2027.

Table of contents

Executive Summary

3D IC and 2.5D IC Packaging Market from Consainsights analyses the 3D IC and 2.5D IC Packaging Market Market in the Technology & Media industry over the forecast period to 2027.

Figure 1: 3D IC and 2.5D IC Packaging Market Size, 2019-2027

3D IC and 2.5D IC Packaging Market research report from Consainsights outlines the detailed strategic analysis, trends, market opportunities, growth prospects, industry and market challenges and sustainable solutions to sustain in the competitive environment.

3D IC and 2.5D IC Packaging Market segmentation includes Packaging Technology, Application, End-User Industry and Geography.

All segmentations encompasses the key innovations and micro & macro trends, companies/manufacturers operating in this space along with their usage and penetration with respect to the wide range of End Users. Additionally, market sizing information along with the key factors such as market drivers, restraints, opportunities and challenges which are likely to be influencing the market growth are outlined in this report.

Based on the Packaging Technology, the 3D IC and 2.5D IC Packaging Market analysis covers Wafer-Level Chip-Scale Packaging (WLCSP), TSV, 2.5D.

Figure 2: 3D IC and 2.5D IC Packaging Market Share (%), Packaging Technology 2021

Based on the Application, the 3D IC and 2.5D IC Packaging Market analysis covers Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power, Analog & Mixed Signal, RF, Photonics.

Figure 3: 3D IC and 2.5D IC Packaging Market Share (%), Application 2021

Based on the End-User Industry, the 3D IC and 2.5D IC Packaging Market analysis covers Consumer Electronics, Telecommunication, Industrial Sector, Automotive, Military & Aerospace, Smart Technologies, Medical Devices.

Figure 4: 3D IC and 2.5D IC Packaging Market Share (%), End-User Industry 2021

Key companies operating in the market include Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), ASE Group (Taiwan), Amkor Technology (U.S.), United Microelectronics Corp. (Taiwan), Stmicroelectronics Nv (Switzerland)., Broadcom Ltd. (Singapore), Intel Corporation. (U.S.), Jiangsu Changjiang Electronics Technology Co., Ltd (China) and so on. This report covers the detailed analysis of the company profiles such as business segments, product portfolio, key brand insights and growth strategies adopted, company SWOT and Strategy analysis along with the financial analysis and analyst insights on the key companies operating in this market.

Moreover, the competitive analysis includes the companies deals such as Mergers, Acquisitions, Partnerships and so on along with the expansion areas focusing on the additional geographies, future insights for success and market share analysis. Major players strategies include the launch of the innovative product lines along with the emphasis on the partnerships and acquisitions to standardize their market share in the market space.

Market Research methodology includes the triangulation of the data from the data sources such as Primary Market Research approach and Secondary Market Research Approach along with the data from the trade bodies and industry standard publications and data sources. Primary inputs from the industry experts and the market respondents from the respective industries to obtain very critical information to assess the future growth prospects of the market. The final data is triangulated and thoroughly validated considering all the data sources using the bottom-up and the top-down approaches to estimate the market sizing of the individual segments.

Market Overview

Definition & Scope

  • The base currency considered was the US Dollar (USD). Conversion of other currencies to USD was considered on the basis of the average exchange rate for the respective review-period years. The exchange rate conversion for forecast period was determined according to the base year’s conversion rates.
  • The base year was identified based on the availability of annual reports and secondary information. The base year considered for this study is 2027.
  • The review period considered for this study is from 2018-2027. The CAGR is for the forecast period, 2022-2027.
  • Market size estimations for the forecast years were in real terms. Inflation is not part of the pricing, and the average selling price (ASP) was kept constant throughout the forecast period for each country.
  • Distribution of primary interviews conducted was based on the regional share of the market and the presence of key players in each region.
  • As a result of data triangulation through multiple methodologies and approaches, the weighted averages of resulting estimates were considered to be the final values.

By Packaging Technology

Introduction

By By Packaging Technology, The 3D IC and 2.5D IC Packaging Market analysis covers Wafer-Level Chip-Scale Packaging (WLCSP), TSV, 2.5D.

Table: 1: 3D IC and 2.5D IC Packaging Market Size, By By Packaging Technology

Wafer-Level Chip-Scale Packaging (WLCSP)

The Wafer-Level Chip-Scale Packaging (WLCSP) segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

TSV

The TSV segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

2.5D

The 2.5D segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

By Application

Introduction

By By Application, The 3D IC and 2.5D IC Packaging Market analysis covers Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power, Analog & Mixed Signal, RF, Photonics.

Table: 2: 3D IC and 2.5D IC Packaging Market Size, By By Application

Logic

The Logic segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Imaging & Optoelectronics

The Imaging & Optoelectronics segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Memory

The Memory segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

MEMS/Sensors

The MEMS/Sensors segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

LED

The LED segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Power, Analog & Mixed Signal, RF, Photonics

The Power, Analog & Mixed Signal, RF, Photonics segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

By End-User Industry

Introduction

By By End-User Industry, The 3D IC and 2.5D IC Packaging Market analysis covers Consumer Electronics, Telecommunication, Industrial Sector, Automotive, Military & Aerospace, Smart Technologies, Medical Devices.

Table: 3: 3D IC and 2.5D IC Packaging Market Size, By By End-User Industry

Consumer Electronics

The Consumer Electronics segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Telecommunication

The Telecommunication segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Industrial Sector

The Industrial Sector segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Automotive

The Automotive segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Military & Aerospace

The Military & Aerospace segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Smart Technologies

The Smart Technologies segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

Medical Devices

The Medical Devices segment market was valued at US$ XX Mn in 2019 and grown at XX% CAGR over the historic years (2019 - 2027) to reach US$ XX Mn and is projected to grow at XX% CAGR over the forecast period to reach US$ XX Mn by 2027. The market represented the US$ XX Mn opportunity over 2019 - 2027 and estimated to create US$ XX Mn opportunity over 2019 - 2027.

North America

Introduction

Based on the North America, the 3D IC and 2.5D IC Packaging Market analysis covers US, Canada.

Table 4: North America 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 5: North America 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 6: North America 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

US

Table 7: US 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 8: US 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 9: US 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Canada

Table 10: Canada 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 11: Canada 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 12: Canada 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Europe

Introduction

Based on the Europe, the 3D IC and 2.5D IC Packaging Market analysis covers Germany, United Kingdom, France, Spain, Russia, Italy, Rest of Europe.

Table 13: Europe 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 14: Europe 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 15: Europe 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Germany

Table 16: Germany 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 17: Germany 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 18: Germany 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

United Kingdom

Table 19: United Kingdom 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 20: United Kingdom 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 21: United Kingdom 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

France

Table 22: France 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 23: France 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 24: France 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Spain

Table 25: Spain 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 26: Spain 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 27: Spain 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Russia

Table 28: Russia 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 29: Russia 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 30: Russia 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Italy

Table 31: Italy 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 32: Italy 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 33: Italy 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Rest of Europe

Table 34: Rest of Europe 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 35: Rest of Europe 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 36: Rest of Europe 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Asia-Pacific

Introduction

Based on the Asia-Pacific, the 3D IC and 2.5D IC Packaging Market analysis covers China, Japan, India, Southeast Asia, Australia & New Zealand, Rest of Asia-Pacific.

Table 37: Asia-Pacific 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 38: Asia-Pacific 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 39: Asia-Pacific 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

China

Table 40: China 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 41: China 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 42: China 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Japan

Table 43: Japan 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 44: Japan 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 45: Japan 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

India

Table 46: India 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 47: India 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 48: India 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Southeast Asia

Table 49: Southeast Asia 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 50: Southeast Asia 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 51: Southeast Asia 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Australia & New Zealand

Table 52: Australia & New Zealand 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 53: Australia & New Zealand 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 54: Australia & New Zealand 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Rest of Asia-Pacific

Table 55: Rest of Asia-Pacific 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 56: Rest of Asia-Pacific 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 57: Rest of Asia-Pacific 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Middle-East & Africa

Introduction

Based on the Middle-East & Africa, the 3D IC and 2.5D IC Packaging Market analysis covers Middle East, Africa, Rest of Middle East & Africa.

Table 58: Middle-East & Africa 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 59: Middle-East & Africa 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 60: Middle-East & Africa 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Middle East

Table 61: Middle East 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 62: Middle East 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 63: Middle East 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Africa

Table 64: Africa 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 65: Africa 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 66: Africa 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Rest of Middle East & Africa

Table 67: Rest of Middle East & Africa 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 68: Rest of Middle East & Africa 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 69: Rest of Middle East & Africa 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Latin America

Introduction

Based on the Latin America, the 3D IC and 2.5D IC Packaging Market analysis covers Brazil, Argentina, Mexico, Colombia, Rest of Latin America.

Table 70: Latin America 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 71: Latin America 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 72: Latin America 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Brazil

Table 73: Brazil 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 74: Brazil 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 75: Brazil 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Argentina

Table 76: Argentina 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 77: Argentina 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 78: Argentina 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Mexico

Table 79: Mexico 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 80: Mexico 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 81: Mexico 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Colombia

Table 82: Colombia 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 83: Colombia 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 84: Colombia 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Rest of Latin America

Table 85: Rest of Latin America 3D IC and 2.5D IC Packaging Market Size, Packaging Technology 2019-2027
Table 86: Rest of Latin America 3D IC and 2.5D IC Packaging Market Size, Application 2019-2027
Table 87: Rest of Latin America 3D IC and 2.5D IC Packaging Market Size, End-User Industry 2019-2027

Company Analysis

Introduction

Key companies operating in the market include Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), ASE Group (Taiwan), Amkor Technology (U.S.), United Microelectronics Corp. (Taiwan), Stmicroelectronics Nv (Switzerland)., Broadcom Ltd. (Singapore), Intel Corporation. (U.S.), Jiangsu Changjiang Electronics Technology Co., Ltd (China) and so on. This report covers the detailed analysis of the company profiles such as business segments, product portfolio, key brand insights and growth strategies adopted, company SWOT and Strategy analysis along with the financial analysis and analyst insights on the key companies operating in this market.